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VIZTA

The VIZTA project objectives are to develop innovative technologies in the field of optical sensors and laser sources for short- to long-range 3D-imaging and to demonstrate their value in several key applications in the automotive, security, smart building, mobile robotics for smart cities and Industry 4.0 sectors.



Published on 27 May 2024

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Identification with Z-sensing Technologies and key Applications, Vision

The VIZTA project objectives are to develop innovative technologies in the field of optical sensors and laser sources for short- to long-range 3D-imaging and to demonstrate their value in several key applications in the automotive, security, smart building, mobile robotics for smart cities and Industry 4.0 sectors.





 

Starting date : Mai 2019 > Oct.2023

Lifetime: 42 months


 

Program in support : H2020-ECSEL-2018-1-IA


 

Status project : in progress


CEA-Leti's contact :

Alexis Rochas

Laurent Fulbert


 

Project Coordinator: STMicroelectronics Grenoble 2 (FR)

Partners:  

  • DE: DFKI German Research Centre for Artificial Intelligence, Ibeo Automotive Systems, Philips Photonics
  • ES: Alter Technology, Bcb Informatica Y Control, Beamagine, Eurecat, Polytechnic University of Catalonia
  • FR: III-V Lab, Applied Materials, CEA-Leti, CEAList, Idemia, Lumibird, ST Microelectronics Crolles 1, ST Microelectronics Crolles 2, ST Microelectronics Grenoble
  • GB: ST Microelectronics
  • GR: ISD Integrated Systems Development
  • HU: Semilab
  • LU: IEE International Electronics and Engineering
  • LV: EDI Institute of Electronics and Computer Science
  • SE: Veoneer


​Target market: n/a

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This project received funding from the JU ECSEL, from the French government as part of the Nano2022 program and from the Auvergne-Rhône-Alpes region.​​

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Stakes
CEA-Leti occupies a central role in the VIZTA project through its:

  • Support to ST Microelectronics in achieving industrial maturity of a new generation of single photon avalanche diodes and indirect time-of-flight pixels for short-distance 3D-imaging. TCAD studies, pixel simulation and design, testing, characterization and assistance in specific technological steps have been conducted in CEA-Leti cleanrooms

  • Study and silicon-based validation of complex RGB+Z pixel architectures for multimodal 2D/3D imaging. Architectures based on lock-in or SPAD pixels for depth sensing (including rolling or global shutters for the RGB imager) based on monolithic or 3D integrations using a depth sensing pixel in place of a green pixel or a full Bayer have been considered. CEA-Leti is also in charge of full color image reconstruction, i.e. interpolation of missing color components along with edge detail conservation, artefacts and noise reduction

  • Simulation, design and 12» wafer fabrication of the optical stacks including microlenses (gapless, diffractive and inner microlenses) and filters for the 3D and multi-modal innovative imagers fabricated during the project

  • Investigation of new 3D integration schemes including Face-to-Back and the opportunity to include small-size TSV connections (typically 1 μm diameter)

  • Research related to optimization of a silicon photonics integrated circuit offering an optical phase array function for medium-range automotive Lidars

  • Development of 1D and 2D MEMS micromirrors with a new actuation system for long-range automotive Lidars.

OBJECTIVES

  • The key, differentiating, 12» silicon sensing technologies developed in the VIZTA project embrace:
    • Innovative sensors for SPAD and lock-in pixel for time-of-flight architecture
    • On-chip solutions involving unprecedented, cost-effective NIR and RGB-Z filters
    • Complex RGB+Z pixel architectures for multimodal 2D/3D imaging
    • Advanced VCSEL sources including wafer-level GaAs optics and associated high-speed driver for short-range sensors.
    These differentiating technologies allow development and validation of innovative 3D imaging sensor products using the following highly integrated prototype demonstrators:
    • High resolution, time-of-flight ranging sensor module with integrated VCSEL, drivers, filters and optics
    • Very high resolution (VGA min) depth camera sensor with integrated filters and optics.
    With regard to medium- and long-range sensing, VIZTA also addresses new LiDAR systems with dedicated sources, optics and sensors. Technological development of sensors and emitters is conducted by leading semiconductor product suppliers (ST Microelectronics,
    Philips, III-V Lab) with the support of equipment suppliers (Amat, Semilab) and CEA-Leti RTO. The VIZTA project also features development of six demonstrators for key applications in the automotive, security, smart building, mobile robotics for smart cities
    and Industry 4.0 sectors based on a strong combination of industrial and academic partners (Ibeo, Veoneer, Ficosa, Beamagine, IEE, DFKI, UPC, Idemia, CEA-List, ISD, BCB, IDE, Eurecat and FCC). The VIZTA consortium brings together 23 partners from 9 European
    countries: France, Germany, Spain, Greece, Luxembourg, Latvia, Sweden, Hungary, and the United Kingdom.


IMPACT

  • The VIZTA project represents a prime opportunity for establishing Europe as a leader and worldwide supplier of advanced 3D imaging sensors and systems. This is being achieved through total control of the entire value
    chain from Si technologies and heterogeneous integration to system equipment makers. VIZTA is strengthening the innovation and competitiveness of its partners, in particular by enabling large volume production of high-end imaging sensors based on STMicroelectronics’ wafer production capacity in Crolles, France.